NXP said on June 5, 2024 that it plans to form a joint venture with Vanguard International Semiconductor Corporation (VIS) to build and operate a new 300mm semiconductor wafer fab in Singapore.

8-KOther EventsFiled Jun 5, 2024Period of report Jun 5, 2024Summary published (UTC) Oct 26, 2026

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NXP said on June 5, 2024 that it plans to form a joint venture with Vanguard International Semiconductor Corporation (VIS) to build and operate a new 300mm semiconductor wafer fab in Singapore.
The company said the total cost of the initial build-out is expected to be $7.8 billion. It said VIS will inject $2.4 billion for a 60% equity stake, and NXP will inject $1.6 billion for a 40% stake.
The company said VIS and NXP have agreed to contribute an additional $1.9 billion to support long-term capacity infrastructure. It said the remaining funding, including loans, will be provided by third parties to the joint venture. VIS will operate the fab.
The company said the joint venture expects to begin construction of the initial phase in the second half of 2024 and to make initial production available to customers during 2027, pending receipt of all required regulatory approvals. It said expected output in 2029 is 55,000 300mm wafers per month.

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Analysis scope · Filing body and confirmed press-release exhibitWe analyzed the filing body and confirmed exhibits. This is not a review of other exhibits, investor presentations or the full earnings call.

Plan to Form Singapore 300mm Wafer Fab Joint Venture

NXP said on June 5, 2024 that it plans to form a joint venture with Vanguard International Semiconductor Corporation (VIS) to build and operate a new 300mm semiconductor wafer fab in Singapore.

Source · Based on the filing body and exhibits

Initial Investment Size and Equity Structure of Joint Venture

The company said the total cost of the initial build-out is expected to be $7.8 billion. It said VIS will inject $2.4 billion for a 60% equity stake, and NXP will inject $1.6 billion for a 40% stake.

Source · Based on the filing body and exhibits

Additional Contributions and Outside Financing Structure

The company said VIS and NXP have agreed to contribute an additional $1.9 billion to support long-term capacity infrastructure. It said the remaining funding, including loans, will be provided by third parties to the joint venture. VIS will operate the fab.

Source · Based on the filing body and exhibits

Construction Timeline and Production Plan

The company said the joint venture expects to begin construction of the initial phase in the second half of 2024 and to make initial production available to customers during 2027, pending receipt of all required regulatory approvals. It said expected output in 2029 is 55,000 300mm wafers per month.

Source · Based on the filing body and exhibits

AI summarized the filing and translated the summary into English; it may differ from the original. For reference only, not investment advice. AI translated the published Korean report into English. Figures are copied as filed, not recalculated.

Original filing

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