Sungho Electronics corrected its announcement of a decision to issue bonds with warrants on September 27, 2024 and submitted additional supporting documents related to maturity redemption.

Sungho Electronics is correcting the announcement of the decision to issue bonds with warrants submitted on September 27, 2024. The company said it submitted supporting documents including an issuance registration confirmation certificate and board meeting minutes to add maturity redemption supporting evidence.

1. 01

   The company is correcting the announcement of the decision to issue bonds with warrants originally disclosed on September 27, 2024.

2. 02

   The reason for the correction is the addition of maturity redemption supporting documents, and supporting documents including an issuance registration confirmation certificate and board meeting minutes are being added.

3. 03

   The bonds with warrants are in the form of bearer warrant bonds, unsecured, and privately placed.

An AI model translated the Korean summary of this filing into English; every number is carried over from the Korean original. Reference information, not investment advice.

Key figures

Initial announcement submission date

September 27, 2024

Corrected announcement submission date

October 2, 2026

Filing facts

Filing type

Bond Issuance

Report name

[Attachment Amended] Decision on Bond with Warrants Issuance

Filed

Oct 6, 2026

Receipt number

20261002000673